Latest News

  • Mar 24, 2017
    TELSONIC at the productronica in China, March 2017

    Productronica_Shanghai.jpg Innovation all along the line: The productronica in China is very important for us to connect with our customers, see what the industry trend is, and extend our business area year by year.

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  • Mar 23, 2017
    Packing pasta with ultrasonics

    Altopack_Webseite_01.jpg Spaghetti is typically packed in horizontal packaging machines. It is becoming ever more common for pasta to be cut into equal lengths and pre-proportioned with ultrasonic sonotrodes after it has been dried. In the next process step it arrives on a conveyor belt and is packed in a tubular bag.

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  • Mar 22, 2017
    TELSONIC attended The Automation Technology Expo (ATX West)

    Messebild_ATX_Kombi_01.jpg This year’s ATX West show had by far the largest turnout that Telsonic have ever experienced.

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  • Mar 21, 2017
    e-mobility demands battery expertise

    e-mobility.jpg Anyone with proven competence in battery production is very much in demand in the age of e-mobility and smartphones.

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  • Mar 9, 2017
    Telsonic Wire Splicing Systems Gain Popularity

    TelsoSplice_IMAGE_BOA_6936_04.jpg Specialist manufacturers and suppliers of components such as wiring harnesses and companies involved in panel build are increasingly turning to Telsonic’s Ultrasonic Wire Splicing Technology as an alternative to more traditional methods of joining wires. In this article, Telsonic’s Martin Frost explains the reasons behind this shift to ultrasonics and the benefits that can be realised by adopting the process.

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  • Feb 21, 2017
    TELSONIC develops valve applicator for the packaging industry

    Valve_applicator_02.jpg TELSONIC AG has developed a new ultrasonic applicator for the packaging industry. In various field tests at customers in Italy, this has been classified as very good.

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