Feb 21, 2017

TELSONIC develops valve applicator for the packaging industry


TELSONIC AG has developed a new ultrasonic applicator for the packaging industry. In various field tests at customers in Italy, this has been classified as very good. It is ready for sale immediately. The module is used to weld standard aroma protection or degassing valves to flexible packaging films, with the mechanical cutter integrated centrally in the sonotrode easily breaking open the film between the valve and the film for degassing purposes. Therefore, two previously required operations are amalgamated into one tool and hence implemented in a highly-compact station. The integration into packaging systems is user-friendly thanks to the simple interface (4 screws).

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