Power electronics IGBT Welding on ceramic substrates

In ultrasonic welding on metallised ceramic substrates as used for power electronics, IGBT modules, in telecommunication, for cooling devices and high-performance LEDs, using a gentle method is mandatory. The torsional welding process is therefore perfectly suited for these applications and offers various additional advantages such as free movement to all directions and a large immersion depth.

Alternatively, the longitudinal metal welding process is available which also has its advantages depending on the application.

 

 




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TELSONIC Ultrasonics Inc.

TELSONIC Solutions Inc.